Low Viscosity Bis-F Epoxy Resin –
Low viscosity, undiluted Bis-F phenol novolac resin with high functionality. Increased flexibility and chemical resistance as compared to standard Bis-A resins. Higher functionality (2.15) than competitive resins of similar viscosity. Exceptionally low hydrolyzable chloride content makes this resin a good material for electronics applications such as potting and encapsulation. No solvents, 100% solids, low odor and toxicity, DOT non-regulated
Filament winding, hand lay up laminating, vacuum bagging, tooling and pattern work, electronics, castings, surface coatings and chemically resistant flooring.
Properties of Rhino 1355 Epoxy Resin (neat)
|Viscosity:||3,500 - 5,000 cps|
|Weight/Gal:||9.9 - 10.0 lbs|
|EEW:||164 - 176|
|Hydrolyzable Chlorides:||<0.10% max|
|Color:||3 max (Gardner)|
|Competitive Offsets:||Ciba 281/282, Dow 354, Shell 862|
Use and store between 65° – 80°F (product and ambient temperatures), 45°F minimum. Use below 45°F requires special hardener selection, consult with Rhino sales personnel for low temperature recommendations. Remove all surface contaminates such as water, dirt, rust, and petroleum products. Mold surfaces must be waxed or otherwise “released” prior to epoxy application. All Rhino Hardeners are compatible with Rhino 1355 and should be proportioned in accordance with the selected Rhino Hardener mix ratio. Use of Rhino 1355 resin in RTM or filament winding processes require specialized hardener(s) and equipment. Mix resin and hardener for 3 – 5 minutes being certain to scrape the bottom and sides of the mixing container. Mix no more material than can be applied before the expiration of the pot life.
Rhino 1355 curing is determined by the selected Rhino hardener, see the hardener technical data sheet.
9lb Gallons, 45lb Pails, and 500lb Drums. FOB San Diego.